Teledyne e2v has been producing turnkey focal plane arrays, camera systems, electronics and astronomical cameras for over 15 years. As part of our advanced system and instrument group we act as your partner to collaborate and develop the next generation of scientific products and technologies.
For the Javalambre Physics of the Accelerating Universe Astrophysical Survey, J-PAS, a 2.5m ground telescope in Spain funded by a consortium of Spanish and Brazilian astronomy institutes, Teledyne e2v designed and manufactured a 1.2 Gigapixel camera. The Teledyne e2v camera subsystem has an extremely large field of view and sensitivity, which will enable it to perform an unprecedented photometric survey of 8,500 square degrees of the sky. This will help to build a 3D map of the Universe, while obtaining precise redshifts (better than 0.3 % accuracy) for more than half a billion galaxies. The combination of redshifts precision and sheer numbers, unmatched by any other existing survey, will provide astrophysics with unprecedented knowledge about dark energy and the evolution of galaxies.
Teledyne e2v has extensive capabilities and heritage in focal plane array development. With investment into new equipment, especially in the areas of improving positioning and metrology accuracy, we are able to provide full turnkey design and manufacture of complex small up to very large custom focal planes and associated integrated electronic, mechanical and cooling sub-systems for both butting CCD and CMOS arrays.
Imaging sub-systems development requires specialist test techniques such as in-vacuum electro-optical testing. Teledyne e2v is able to test from a single to multiple small and large devices in a focal plane array.
With a dedicated environmental and mechanical testing and large bed metrology facilities, for very large focal planes, we are able to conduct all temperature cycling, vibration (where applicable) and coordinate measurements for highly accurate positional and flatness verification. As with the electro optical, testing this expands existing testing of individual devices to full focal plane arrays.
Teledyne has a broad range of specialist on die anti-reflective coatings, package surface treatment and window spectral filter design and process capabilities including up to 8” silicon wafer backthinning and die, package and optical window coatings and filters.
Our proprietary backthinning technology and processing lines enable high quantum efficiency to be achieved from imaging sensors, and the majority of high-specification scientific and also space applications are backthinned.
The technology of thinning and back-illumination, that by avoiding losses in the electrode structure, enables a high quantum efficiency to be achieved right across the useful spectral range of silicon based image detectors for X-ray to near infrared wavelengths.
CMOS sensors offer advantages over CCDs for a number of these applications and it is possible to back-thin CMOS devices and obtain in many cases the same performance as the CCD.
Located in Chelmsford, Essex, UK, Teledyne e2v’s world class CCD and silicon processing fab acts as a global imaging capability for the image sensor industry. The backthinning lines for both 6 inch and 8 inch wafers are operated on a batch basis and allows for small to medium volumes of wafers to be processed with capacity to service third party companies needs in this technology. Please contact us for more information.
Our advanced systems and instruments technology group comprises scientists, engineers and designers that collaborate to invent and develop new sensor products, technologies and systems solutions.