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You missed our Live Demo event! Here is all the material you need to catch up!

During this week of Electronica Virtual 2020, we were pleased to introduce our latest product announcements and innovations. Our engineering team worked very hard on developing four product demonstrations & a webinar which we broadcasted Live using two web TV studios on site in Grenoble.

We performed over 50 Live demos online during 5 days and had over 200 participants!
We would like to thank all who took the time to join our Teams during this event!

If you couldn’t make it to the event or wish to learn more, please check out the links below!

DEMONSTRATING THE MOST ADVANCED MICROWAVE CAPABLE ADC SAMPLING SIGNALS DIRECTLY UP TO KA-BAND

Was introduced the first live demonstration of the most advanced Analog-to-Digital Converter (ADC) demonstrator chip from Teledyne e2v: PS640. This proof-of-concept is capable of microwave direct sampling, preparing the future generation of very high frequency direct sampling solutions. In order to ease the integration into the RF front-ends and frequency synthesis units, the ADC is single-ended on both its microwave and clock inputs. The ADC was described and presented in its evaluation environment.

Performance have been showcased sampling directly the signals coming from a signal generator.

Recordings and related material to download:

You need further info or wish to plan a one-to-one call:

EV12DD700 Data Converter

DEMONSTRATING THE MOST ADVANCED MICROWAVE CAPABLE DAC GENERATING SIGNAL WAVEFORMS IN MULTIPLE FREQUENCY BANDS UP TO KA

Was presented the first live demonstration of the most advanced Digital-to-Analog Converter (DAC) from Teledyne e2v, EV12DD700. The latest 12-bit dual channel 12 GSps DAC is capable of generating signal waveforms over multiple frequency bands up to Ka-band. The DAC was shown in its evaluation environment with the description of all its functionalities.

Performance was showcased on spectrum plots up from 26.5GHz exhibiting the widest instantaneous bandwidth up to 6 GHz.

Recordings and related material to download:

You need further info or wish to plan a one-to-one call:

SAVE POWER & SIMPLIFY THERMAL MANAGEMENT IN HIGH RELIABILITY PROCESSING SYSTEMS

Teledyne e2v’s team presented a practical demonstration of how we can help reducing power consumption of processors compared to commercial parts. The demonstration has exhibited two T1042 (quad-core 1.4GHz) processors, one that is a standard commercial processor running at full CPU load to comply with datasheet power, and one that is an enhanced processor running a customer representative application to show effective power savings. Case temperature and actual power consumption of both processors were displayed with IR camera and LCD displays. On the enhanced processor, the power savings translated both in terms of lower case temperature and lower power consumption.

Recordings and related material to download:

You need further info or wish to plan a one-to-one call:

MOST COMPACT PROCESSING PLATFORM REDUCING SYSTEM MISSION COMPUTER DESIGN AND OBSOLESCENCE CHALLENGE

This Live demo introduced our latest Qormino® processing modules which help designers and project managers to mitigate their design challenges for processing systems, by offering an ultra-compact solution integrated in a safety-critical and certifiable ecosystem. The demonstration exhibited a QT1040-4GB module, which features a quad-core 1.4GHz processor and a 4GB DDR4 memory, that exchanged data up to 1.6GT/s, all this included in a 44x26mm format. The cockpit control of a UAV was emulated by the Qormino®, to demonstrate a typical application of such device. The Qormino® ran the real-time operating system VxWorks® 7, which executed an application developed by Presagis to emulate the UAV control display. The Qormino® was interfaced with a CoreAVI Graphical Processing Unit (GPU) through PCIe, which served to display the UAV information on a screen.

Recordings and related material to download:

You need further info or wish to plan a one-to-one call:

 

 

WEBINAR: YOUR TRUSTED PARTNER FOR SYSTEM-IN-PACKAGE

During this Live webinar session, our team presented our electronic assembly facility and how our customers can benefit from our expertise to assemble advanced SiP components. Our technical experts discussed topics around our different capabilities and roadmaps, including multi-die assembly on organic substrate, heterogeneous dies integration, and co-conception of complex SiP for the harshest environments such as Space, Aerospace & Defense markets.

Recordings and related material to download:

You need further info or wish to plan a one-to-one call: