Advancing RF SOI since 1988, Peregrine delivers the superior performance, monolithic integration and reliability required by demanding Hi-Rel designs.
Central to Peregrine’s success is its UltraCMOS® technology—a patented, advanced form of RF SOI. For Hi-Rel products, UltraCMOS technology circuitry is processed on an ultra-thin silicon layer atop a dielectric sapphire wafer. Variable capacitances in the junction region are virtually eliminated, reducing the overall current drain and improving the transistor’s voltage handling and linearity. UltraCMOS technology is inherently radiation tolerant. Peregrine’s Hi-Rel products do not contain the bulk parasitics found in standard CMOS devices, making latch-up virtually impossible.
Only UltraCMOS technology enables intelligent integration—a unique design ability to integrate RF, digital and analog components onto a single, monolithic die. This high level of integration results in a smaller IC, reducing overall design size and the number of external components required.