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Industrialization and Manufacturing Services

Teledyne e2v Grenoble provides state-of-the-art Assembly and Test services to customers seeking high-end packaging technologies.

  • Package type options: Wire Bond, Flip-chip, BGA, SiP, MCM,…
  • Tailor-made approach
  • Low and medium volume
  • Hi-Rel / High-end / Specific Assembly & Test
  • Supported products: Microprocessors, FPGAs, Asics, Data Converters, image Sensors…
  • Semiconductor Lifecycle Management: Support of obsolete solutions, such as SnPb devices
  • Segregation of data and flow as per customer reques

 

Industrialization Manufacturing Services Factory Tour

This short video shows an overview of our INDUSTRIALIZATION and MANUFACTURING SERVICES and how Teledyne e2v Grenoble provides state-of-the-art Assembly and Test services to customers seeking high-end packaging technologies.

#Industrialization #Manufacturing #Semiconductor #Test #Service