About Us
Facilities
Clean room
Assembly
1000 m², ISO5 class (100)
1000 m², ISO6 class (1000)
nb: sealing workstation under ISO 4 class (10)
test : 58m² class ISO5 (100)
ESD protection
IEC 61340-5-1 / 5-2 compliant
Local ionization for sensitive areas….
Regulated temperature and humidity
History
Since the opening of the site in 1955, we’ve gained and kept knowledge and experts in package design, assembly & test.
1955: SESCOSEM opens: Diodes, transistors & vacuum tube imagers
1978: The beginning of CCD product activities
1984: Becomes Thomson-CSF Military & Space Division: Integrated circuits
1992: Thomson-CSF begins manufacturing specific Semiconductors
2000: Becomes Atmel Grenoble
2006: Becomes e2v
2017: Becomes Teledyne e2v
Facts
The Teledyne e2v Assembly & Test Services are located in Grenoble at the heart of the “French Silicon Valley”, an area populated by microelectronic companies.
- 24/7 assembly and testing services
- 150 highly skilled operators, technician & engineers
- Class ISO5 (class 100) assembly clean rooms
- EN/AS 9100 & US QML V certified
- QML Y certification in progress
Courtesy of Minalogic
Packaging
Design
Part of an ecosystem:
- 25 years partnership with major package/substrate suppliers
- 2 SiP Design Houses partnerships
Package design capabilities:
- Routing: Cadence APD, Autocad
- Ansys HFSS (3D electromagnetic simulation), Ansys thermal simulation
- HSSL up to 12 Gbps
Packaging Technologies
Flip-Chip
We have the experience of designing and creating flip-chip packages using state-of-the-art machinery and materials, developing hermetic or non-hermetic ceramic solutions.
- Thermal Interface Material (TIM) lids or lidless solutions
- SMT – Leaded and RoHS
- Seals – Kovar (hermetic), Copper (non-hermetic)
- Connections:
High lead PbSn 90/10, 95/5
Eutectic SnPb - Package material options include Alumina, Aluminium Nitride and HiTCE
- Available for solutions up to 45x45mm, 1752 I/Os
Wire bond
With over 35+ years’ experience of developing ICs, we have a long history of developing wire bonded solutions.
- Wire bond in Aluminium or Gold
- SMT – Leaded or RoHS
- Seal options include: AuSn, Glass, Seam, Epoxy, Window or Dam & Fill
- Die attachment – Cyanate ester, Silver glass or Epoxy
- Mono or Multi Die (MCM/SiP)
- Package material options include: Alumina, Aluminium Nitride, HiTCE, Organic, LTCC
Wafer processing
Wafer sawing
- Fully automatic Wafer saw of substrates up to 8” diameter and down to 300µm in thickness (Working closely with our partner companies OMS can offer 12” dicing solution)
- Advanced cleaning solution (Atomizing Nozzle, Dicing Fluid)
- Programmable water resistivity
- Multi-Project Wafers
- Optimised process for sawing and washing for sensitive device
Optical inspection
- Compatible up to 300 mm wafer size, waffle pack and Gelpack
- Highly skilled operators inspect the wafer in accordance with standards or dedicated specifications
- Semi-automated defect inspection machine
- Great experience on different technology (CMOS, CCD, bumped wafer…)
Die bonding
- Full auto, Multi material die attach (epoxy, cyanate ester, silver glass)
- MCM (Multi Chip Module) solutions
- Large die assembly capability and high placement accuracy (in line control)
- Furnace and oven with controlled atmosphere
- ISO 5 oven for glue curing
Wire Bonding
- Full auto Aluminum wedge bonding, 25µm to 32µm wire diameter, pitch down to 75µm
- Full auto Gold ball bonding, 20 to 23µm wire diameter, pitch down to 50µm
- Long experience in wire bonding with multi deck product up to 2000 Wires
- Can study all specific configuration
- Wire pull and ball shear test capability with SPC monitoring
Flip Chip
- Full automatic flip chip machine, wafer up to 300 mm , gel pack and waffle pack
- Eutectic and Hi-lead bump (Rohs on demand)
- HiTCE, Al2O3 and AlN ceramic (organic on demand)
- Die size up to 450mm2, more than 7000 bumps
- 12 area controlled atmosphere reflow furnace
- Full Automatic flux cleaner
- Hot Die shear process
Underfill
- Full automatic dispensing and jetting machine with controlled parameters
- Plasma cleaning
- Underfill solutions compatible with large die
- ISO 5 clean room oven
SMT | BGA ball attach
- Automatic printing machine
- 3D screen printing technology
- Full automatic Chip Shooter for SMD attach
- Single package and panel process
- Multi Zone oven with controlled atmosphere
- Ball attach : SnPb (high lead & eutectic), SAC305, polymer balls
Thermal Interface Material (TIM)
- Full automatic dispensing machine with controlled parameters
- Plasma cleaning
- Epoxy & silicone
- Compatible with non hermetic & hermetic sealing
- ISO 5 Clean room oven
Sealing
Hermetic
- Automatic Seam Sealing with controlled N2 atmosphere (Glove Box)
- AuSn reflow hermetic sealing under inert gas atmospheres including N2, N2H2
- Desoxidation process for better moisture level (RGA / vapor content compliant with Mil Std 883 requirement)
Non-hermetic
- Adhesive sealing
- Image sensors: glass window sealing
- Flip Chip devices: heat spreader / metal lid sealing
- Dam & Fill
- Versatile low cost solution for sealing
Marking, Trim & Form
- Marking: pad printing and laser solutions
- Trim & Form
- Full automatic hot solder dipping
- Leak test (fine & gross leak)
- PIND test
Process control
- Heated Die shear machine, Wire pull test, ball shear.
- 3D measurement machine
- Micro focus Xray inspection
- C SAM (acoustic microscopy, 10µm resolution)
- SEM with integrated EDX
- High-performance X-ray fluorescence instruments
Supply Chain
End to end services from one trusted partner.
Manufacturing capabilities:
- Specific assembly
- Test & screening
Supply chain capabilities:
- Purchasing & management
Value chain:
- One-Stop-Shop
- ERP SAP based
- Worldwide suppliers
Lifecycle:
- SLiM™ – Long-term commitment
- Wafer banking
- Manufacturing flows evolution
Compliance and security:
- Traceability & control
- Qualifications & audits
- Counterfeit protection
Screening
Whatever the need, our comprehensive set of equipments will allow to fit your screening need
- 3D measurement machine
- Micro focus Xray inspection
- CSAM (acoustic µscopy, 10µm resolution)
- Leak test (fine & gross leak)
- Pind test
- Burn-in chambers (incl. with individual temp control for high dissipation devices
- Air-to-air temperature cycling
- Lead Scanning (QFP TSOP QFN MLF BGA up to 46mmx46mm)
Testing
Engineering
- Test program transfer or development
- Wafer probe & Final Test interfaces design & manufacturing
- Qualification : Life-Test & environmental testing
- Specific packing
Wide Variety of State-of-the-art Testers
- Digital ICs: Teradyne J971, J973, Tiger, Ultraflex, Ultraflex2 (end of 2017)
- Mixed & RF ICs: Teradyne A585, National Instruments STS (early 2018)
- Image sensors: Teradyne A565IH, dedicated test-benches
Production
- Wafer probe test : -40°C to +125°C (-55°C to 200°C with EG6000)
- Package Test : -55°C to +125°C (and up to +220°C)
- 24h operation for ultimate responsiveness
- Monitoring with F.I.R.M.S.
Low/High Temperature Handler and Probers
- Electroglas EG4090 and EG6000 probers up to 12’’ wafers
- Turbo Flex Delta Design, MT9510 Multitest for a large range of ceramic & plastic packages
High Performance Logic IC Thermal Characterization Unit : Delta Design ETC 2000, Max TC / Flex TC for debug/characterization & manual test
Standards
Our manufacturing, inspection & test flow can be tailored to your needs, ranging from product specific flow to full compliance with ESCC 9000 or Mil Prf 38535 QML Class-V / QML Class-Y.
Quality Systems
Ensuring Quality of Devices :
- Incoming inspection
- In-Process inspection
- Statistical Process Control (SPC) and In-process monitoring program MIL PRF 38535
- Screening & QCI Procedures of MIL STD 883 Methods
Ensuring Quality of Support:
- Environmental & Clean Concept controls
- Electrostatic Discharge (ESD) controls
- Measurement System Analysis (MSA) on testing equipment’s
- Equipment Maintenance & Calibration traceability
- In-process Troubleshooting process by QA team
- Production Process Changes control
- Full traceability managed by ERP System
- Document Management
- Failure Analysis
Continuous Improvement:
- Internal & subcontractor audit program
- Yield improvement program
- Lean Six Sigma program
Certifications
Teledyne e2v level
- ISO 14001: 2004 / OHSAS 18001: 2007 The Grenoble site is “Environment registered facilities (ICPE)” and controlled by the French administrations.
ISO 14001
Site level
- ISO9001 V. 2015 Design, manufacturing and testing of microelectronic components, electronic systems and electronic systems.
- AEO (Authorised Economic Operator) International custom certification.
ISO 9001
Semiconductors Division
- AS9100C – EN9100:2009 Design, manufacturing and testing of microelectronic components for aerospace applications.
- MILPRF 38535 Class Q and V from the American ministry of defence managed by the DSCC (Defense Supply Center Columbus), class V for space market products.
MIL-PRF-38535
Compliance
High level of compliance & reliability cannot be achieved without relevant testing. Through years Teledyne e2v Grenoble has acquired deep knowledge of the failure mechanisms and the associated tests. Each of our packaging technology or assembly process is fully qualified prior to implementation.
In addition our Process & Quality engineers can help you define the optimum test plan for your specific application or product.
- Bond strength (bond pull & ball shear)
- Fine and gross leak
- Lead finish adhesion
- Mechanical shock
- Partical impact noise detection (PIND)
- Resistance to solvents
- Solderability
- Thermal shock
- Constant acceleration
- C SAM
- Internal vapor Content / Residual Gas Analysis (RGA)
- Lead integrity
- Moisture resistance
- Moisture Sensitivity Level (MSL) preconditionning
- Resistance to solder heat
- Salt atmosphere
- Temperature cycling
- Vibration
- ….
Capabilities
Facilities
Clean room
Assembly
1000 m², ISO5 class (100)
1000 m², ISO6 class (1000)
nb: sealing workstation under ISO 4 class (10)
test : 58m² class ISO5 (100)
ESD protection
IEC 61340-5-1 / 5-2 compliant
Local ionization for sensitive areas….
Regulated temperature and humidity
History
Since the opening of the site in 1955, we’ve gained and kept knowledge and experts in package design, assembly & test.
1955: SESCOSEM opens: Diodes, transistors & vacuum tube imagers
1978: The beginning of CCD product activities
1984: Becomes Thomson-CSF Military & Space Division: Integrated circuits
1992: Thomson-CSF begins manufacturing specific Semiconductors
2000: Becomes Atmel Grenoble
2006: Becomes e2v
2017: Becomes Teledyne e2v
Facts
The Teledyne e2v Assembly & Test Services are located in Grenoble at the heart of the “French Silicon Valley”, an area populated by microelectronic companies.
- 24/7 assembly and testing services
- 150 highly skilled operators, technician & engineers
- Class ISO5 (class 100) assembly clean rooms
- EN/AS 9100 & US QML V certified
- QML Y certification in progress
Courtesy of Minalogic
Packaging
Design
Part of an ecosystem:
- 25 years partnership with major package/substrate suppliers
- 2 SiP Design Houses partnerships
Package design capabilities:
- Routing: Cadence APD, Autocad
- Ansys HFSS (3D electromagnetic simulation), Ansys thermal simulation
- HSSL up to 12 Gbps
Packaging Technologies
Flip-Chip
We have the experience of designing and creating flip-chip packages using state-of-the-art machinery and materials, developing hermetic or non-hermetic ceramic solutions.
- Thermal Interface Material (TIM) lids or lidless solutions
- SMT – Leaded and RoHS
- Seals – Kovar (hermetic), Copper (non-hermetic)
- Connections:
High lead PbSn 90/10, 95/5
Eutectic SnPb - Package material options include Alumina, Aluminium Nitride and HiTCE
- Available for solutions up to 45x45mm, 1752 I/Os
Wire bond
With over 35+ years’ experience of developing ICs, we have a long history of developing wire bonded solutions.
- Wire bond in Aluminium or Gold
- SMT – Leaded or RoHS
- Seal options include: AuSn, Glass, Seam, Epoxy, Window or Dam & Fill
- Die attachment – Cyanate ester, Silver glass or Epoxy
- Mono or Multi Die (MCM/SiP)
- Package material options include: Alumina, Aluminium Nitride, HiTCE, Organic, LTCC
Wafer processing
Wafer sawing
- Fully automatic Wafer saw of substrates up to 8” diameter and down to 300µm in thickness (Working closely with our partner companies OMS can offer 12” dicing solution)
- Advanced cleaning solution (Atomizing Nozzle, Dicing Fluid)
- Programmable water resistivity
- Multi-Project Wafers
- Optimised process for sawing and washing for sensitive device
Optical inspection
- Compatible up to 300 mm wafer size, waffle pack and Gelpack
- Highly skilled operators inspect the wafer in accordance with standards or dedicated specifications
- Semi-automated defect inspection machine
- Great experience on different technology (CMOS, CCD, bumped wafer…)
Die bonding
- Full auto, Multi material die attach (epoxy, cyanate ester, silver glass)
- MCM (Multi Chip Module) solutions
- Large die assembly capability and high placement accuracy (in line control)
- Furnace and oven with controlled atmosphere
- ISO 5 oven for glue curing
Wire Bonding
- Full auto Aluminum wedge bonding, 25µm to 32µm wire diameter, pitch down to 75µm
- Full auto Gold ball bonding, 20 to 23µm wire diameter, pitch down to 50µm
- Long experience in wire bonding with multi deck product up to 2000 Wires
- Can study all specific configuration
- Wire pull and ball shear test capability with SPC monitoring
Flip Chip
- Full automatic flip chip machine, wafer up to 300 mm , gel pack and waffle pack
- Eutectic and Hi-lead bump (Rohs on demand)
- HiTCE, Al2O3 and AlN ceramic (organic on demand)
- Die size up to 450mm2, more than 7000 bumps
- 12 area controlled atmosphere reflow furnace
- Full Automatic flux cleaner
- Hot Die shear process
Underfill
- Full automatic dispensing and jetting machine with controlled parameters
- Plasma cleaning
- Underfill solutions compatible with large die
- ISO 5 clean room oven
SMT | BGA ball attach
- Automatic printing machine
- 3D screen printing technology
- Full automatic Chip Shooter for SMD attach
- Single package and panel process
- Multi Zone oven with controlled atmosphere
- Ball attach : SnPb (high lead & eutectic), SAC305, polymer balls
Thermal Interface Material (TIM)
- Full automatic dispensing machine with controlled parameters
- Plasma cleaning
- Epoxy & silicone
- Compatible with non hermetic & hermetic sealing
- ISO 5 Clean room oven
Sealing
Hermetic
- Automatic Seam Sealing with controlled N2 atmosphere (Glove Box)
- AuSn reflow hermetic sealing under inert gas atmospheres including N2, N2H2
- Desoxidation process for better moisture level (RGA / vapor content compliant with Mil Std 883 requirement)
Non-hermetic
- Adhesive sealing
- Image sensors: glass window sealing
- Flip Chip devices: heat spreader / metal lid sealing
- Dam & Fill
- Versatile low cost solution for sealing
Marking, Trim & Form
- Marking: pad printing and laser solutions
- Trim & Form
- Full automatic hot solder dipping
- Leak test (fine & gross leak)
- PIND test
Process control
- Heated Die shear machine, Wire pull test, ball shear.
- 3D measurement machine
- Micro focus Xray inspection
- C SAM (acoustic microscopy, 10µm resolution)
- SEM with integrated EDX
- High-performance X-ray fluorescence instruments
Supply Chain
End to end services from one trusted partner.
Manufacturing capabilities:
- Specific assembly
- Test & screening
Supply chain capabilities:
- Purchasing & management
Value chain:
- One-Stop-Shop
- ERP SAP based
- Worldwide suppliers
Lifecycle:
- SLiM™ – Long-term commitment
- Wafer banking
- Manufacturing flows evolution
Compliance and security:
- Traceability & control
- Qualifications & audits
- Counterfeit protection
Screening
Whatever the need, our comprehensive set of equipments will allow to fit your screening need
- 3D measurement machine
- Micro focus Xray inspection
- CSAM (acoustic µscopy, 10µm resolution)
- Leak test (fine & gross leak)
- Pind test
- Burn-in chambers (incl. with individual temp control for high dissipation devices
- Air-to-air temperature cycling
- Lead Scanning (QFP TSOP QFN MLF BGA up to 46mmx46mm)
Testing
Engineering
- Test program transfer or development
- Wafer probe & Final Test interfaces design & manufacturing
- Qualification : Life-Test & environmental testing
- Specific packing
Wide Variety of State-of-the-art Testers
- Digital ICs: Teradyne J971, J973, Tiger, Ultraflex, Ultraflex2 (end of 2017)
- Mixed & RF ICs: Teradyne A585, National Instruments STS (early 2018)
- Image sensors: Teradyne A565IH, dedicated test-benches
Production
- Wafer probe test : -40°C to +125°C (-55°C to 200°C with EG6000)
- Package Test : -55°C to +125°C (and up to +220°C)
- 24h operation for ultimate responsiveness
- Monitoring with F.I.R.M.S.
Low/High Temperature Handler and Probers
- Electroglas EG4090 and EG6000 probers up to 12’’ wafers
- Turbo Flex Delta Design, MT9510 Multitest for a large range of ceramic & plastic packages
High Performance Logic IC Thermal Characterization Unit : Delta Design ETC 2000, Max TC / Flex TC for debug/characterization & manual test
Standards
Our manufacturing, inspection & test flow can be tailored to your needs, ranging from product specific flow to full compliance with ESCC 9000 or Mil Prf 38535 QML Class-V / QML Class-Y.
Quality Systems
Ensuring Quality of Devices :
- Incoming inspection
- In-Process inspection
- Statistical Process Control (SPC) and In-process monitoring program MIL PRF 38535
- Screening & QCI Procedures of MIL STD 883 Methods
Ensuring Quality of Support:
- Environmental & Clean Concept controls
- Electrostatic Discharge (ESD) controls
- Measurement System Analysis (MSA) on testing equipment’s
- Equipment Maintenance & Calibration traceability
- In-process Troubleshooting process by QA team
- Production Process Changes control
- Full traceability managed by ERP System
- Document Management
- Failure Analysis
Continuous Improvement:
- Internal & subcontractor audit program
- Yield improvement program
- Lean Six Sigma program
Certifications
Teledyne e2v level
- ISO 14001: 2004 / OHSAS 18001: 2007 The Grenoble site is “Environment registered facilities (ICPE)” and controlled by the French administrations.
ISO 14001
Site level
- ISO9001 V. 2015 Design, manufacturing and testing of microelectronic components, electronic systems and electronic systems.
- AEO (Authorised Economic Operator) International custom certification.
ISO 9001
Semiconductors Division
- AS9100C – EN9100:2009 Design, manufacturing and testing of microelectronic components for aerospace applications.
- MILPRF 38535 Class Q and V from the American ministry of defence managed by the DSCC (Defense Supply Center Columbus), class V for space market products.
MIL-PRF-38535
Compliance
High level of compliance & reliability cannot be achieved without relevant testing. Through years Teledyne e2v Grenoble has acquired deep knowledge of the failure mechanisms and the associated tests. Each of our packaging technology or assembly process is fully qualified prior to implementation.
In addition our Process & Quality engineers can help you define the optimum test plan for your specific application or product.
- Bond strength (bond pull & ball shear)
- Fine and gross leak
- Lead finish adhesion
- Mechanical shock
- Partical impact noise detection (PIND)
- Resistance to solvents
- Solderability
- Thermal shock
- Constant acceleration
- C SAM
- Internal vapor Content / Residual Gas Analysis (RGA)
- Lead integrity
- Moisture resistance
- Moisture Sensitivity Level (MSL) preconditionning
- Resistance to solder heat
- Salt atmosphere
- Temperature cycling
- Vibration
- ….
Facilities
Clean room
Assembly
1000 m², ISO5 class (100)
1000 m², ISO6 class (1000)
nb: sealing workstation under ISO 4 class (10)
test : 58m² class ISO5 (100)
ESD protection
IEC 61340-5-1 / 5-2 compliant
Local ionization for sensitive areas….
Regulated temperature and humidity
History
Since the opening of the site in 1955, we’ve gained and kept knowledge and experts in package design, assembly & test.
1955: SESCOSEM opens: Diodes, transistors & vacuum tube imagers
1978: The beginning of CCD product activities
1984: Becomes Thomson-CSF Military & Space Division: Integrated circuits
1992: Thomson-CSF begins manufacturing specific Semiconductors
2000: Becomes Atmel Grenoble
2006: Becomes e2v
2017: Becomes Teledyne e2v
Facts
The Teledyne e2v Assembly & Test Services are located in Grenoble at the heart of the “French Silicon Valley”, an area populated by microelectronic companies.
- 24/7 assembly and testing services
- 150 highly skilled operators, technician & engineers
- Class ISO5 (class 100) assembly clean rooms
- EN/AS 9100 & US QML V certified
- QML Y certification in progress
Courtesy of Minalogic
Packaging
Design
Part of an ecosystem:
- 25 years partnership with major package/substrate suppliers
- 2 SiP Design Houses partnerships
Package design capabilities:
- Routing: Cadence APD, Autocad
- Ansys HFSS (3D electromagnetic simulation), Ansys thermal simulation
- HSSL up to 12 Gbps
Packaging Technologies
Flip-Chip
We have the experience of designing and creating flip-chip packages using state-of-the-art machinery and materials, developing hermetic or non-hermetic ceramic solutions.
- Thermal Interface Material (TIM) lids or lidless solutions
- SMT – Leaded and RoHS
- Seals – Kovar (hermetic), Copper (non-hermetic)
- Connections:
High lead PbSn 90/10, 95/5
Eutectic SnPb - Package material options include Alumina, Aluminium Nitride and HiTCE
- Available for solutions up to 45x45mm, 1752 I/Os
Wire bond
With over 35+ years’ experience of developing ICs, we have a long history of developing wire bonded solutions.
- Wire bond in Aluminium or Gold
- SMT – Leaded or RoHS
- Seal options include: AuSn, Glass, Seam, Epoxy, Window or Dam & Fill
- Die attachment – Cyanate ester, Silver glass or Epoxy
- Mono or Multi Die (MCM/SiP)
- Package material options include: Alumina, Aluminium Nitride, HiTCE, Organic, LTCC
Wafer processing
Wafer sawing
- Fully automatic Wafer saw of substrates up to 8” diameter and down to 300µm in thickness (Working closely with our partner companies OMS can offer 12” dicing solution)
- Advanced cleaning solution (Atomizing Nozzle, Dicing Fluid)
- Programmable water resistivity
- Multi-Project Wafers
- Optimised process for sawing and washing for sensitive device
Optical inspection
- Compatible up to 300 mm wafer size, waffle pack and Gelpack
- Highly skilled operators inspect the wafer in accordance with standards or dedicated specifications
- Semi-automated defect inspection machine
- Great experience on different technology (CMOS, CCD, bumped wafer…)
Die bonding
- Full auto, Multi material die attach (epoxy, cyanate ester, silver glass)
- MCM (Multi Chip Module) solutions
- Large die assembly capability and high placement accuracy (in line control)
- Furnace and oven with controlled atmosphere
- ISO 5 oven for glue curing
Wire Bonding
- Full auto Aluminum wedge bonding, 25µm to 32µm wire diameter, pitch down to 75µm
- Full auto Gold ball bonding, 20 to 23µm wire diameter, pitch down to 50µm
- Long experience in wire bonding with multi deck product up to 2000 Wires
- Can study all specific configuration
- Wire pull and ball shear test capability with SPC monitoring
Flip Chip
- Full automatic flip chip machine, wafer up to 300 mm , gel pack and waffle pack
- Eutectic and Hi-lead bump (Rohs on demand)
- HiTCE, Al2O3 and AlN ceramic (organic on demand)
- Die size up to 450mm2, more than 7000 bumps
- 12 area controlled atmosphere reflow furnace
- Full Automatic flux cleaner
- Hot Die shear process
Underfill
- Full automatic dispensing and jetting machine with controlled parameters
- Plasma cleaning
- Underfill solutions compatible with large die
- ISO 5 clean room oven
SMT | BGA ball attach
- Automatic printing machine
- 3D screen printing technology
- Full automatic Chip Shooter for SMD attach
- Single package and panel process
- Multi Zone oven with controlled atmosphere
- Ball attach : SnPb (high lead & eutectic), SAC305, polymer balls
Thermal Interface Material (TIM)
- Full automatic dispensing machine with controlled parameters
- Plasma cleaning
- Epoxy & silicone
- Compatible with non hermetic & hermetic sealing
- ISO 5 Clean room oven
Sealing
Hermetic
- Automatic Seam Sealing with controlled N2 atmosphere (Glove Box)
- AuSn reflow hermetic sealing under inert gas atmospheres including N2, N2H2
- Desoxidation process for better moisture level (RGA / vapor content compliant with Mil Std 883 requirement)
Non-hermetic
- Adhesive sealing
- Image sensors: glass window sealing
- Flip Chip devices: heat spreader / metal lid sealing
- Dam & Fill
- Versatile low cost solution for sealing
Marking, Trim & Form
- Marking: pad printing and laser solutions
- Trim & Form
- Full automatic hot solder dipping
- Leak test (fine & gross leak)
- PIND test
Process control
- Heated Die shear machine, Wire pull test, ball shear.
- 3D measurement machine
- Micro focus Xray inspection
- C SAM (acoustic microscopy, 10µm resolution)
- SEM with integrated EDX
- High-performance X-ray fluorescence instruments
Supply Chain
End to end services from one trusted partner.
Manufacturing capabilities:
- Specific assembly
- Test & screening
Supply chain capabilities:
- Purchasing & management
Value chain:
- One-Stop-Shop
- ERP SAP based
- Worldwide suppliers
Lifecycle:
- SLiM™ – Long-term commitment
- Wafer banking
- Manufacturing flows evolution
Compliance and security:
- Traceability & control
- Qualifications & audits
- Counterfeit protection
Screening
Whatever the need, our comprehensive set of equipments will allow to fit your screening need
- 3D measurement machine
- Micro focus Xray inspection
- CSAM (acoustic µscopy, 10µm resolution)
- Leak test (fine & gross leak)
- Pind test
- Burn-in chambers (incl. with individual temp control for high dissipation devices
- Air-to-air temperature cycling
- Lead Scanning (QFP TSOP QFN MLF BGA up to 46mmx46mm)
Testing
Engineering
- Test program transfer or development
- Wafer probe & Final Test interfaces design & manufacturing
- Qualification : Life-Test & environmental testing
- Specific packing
Wide Variety of State-of-the-art Testers
- Digital ICs: Teradyne J971, J973, Tiger, Ultraflex, Ultraflex2 (end of 2017)
- Mixed & RF ICs: Teradyne A585, National Instruments STS (early 2018)
- Image sensors: Teradyne A565IH, dedicated test-benches
Production
- Wafer probe test : -40°C to +125°C (-55°C to 200°C with EG6000)
- Package Test : -55°C to +125°C (and up to +220°C)
- 24h operation for ultimate responsiveness
- Monitoring with F.I.R.M.S.
Low/High Temperature Handler and Probers
- Electroglas EG4090 and EG6000 probers up to 12’’ wafers
- Turbo Flex Delta Design, MT9510 Multitest for a large range of ceramic & plastic packages
High Performance Logic IC Thermal Characterization Unit : Delta Design ETC 2000, Max TC / Flex TC for debug/characterization & manual test
Standards
Our manufacturing, inspection & test flow can be tailored to your needs, ranging from product specific flow to full compliance with ESCC 9000 or Mil Prf 38535 QML Class-V / QML Class-Y.
Quality Systems
Ensuring Quality of Devices :
- Incoming inspection
- In-Process inspection
- Statistical Process Control (SPC) and In-process monitoring program MIL PRF 38535
- Screening & QCI Procedures of MIL STD 883 Methods
Ensuring Quality of Support:
- Environmental & Clean Concept controls
- Electrostatic Discharge (ESD) controls
- Measurement System Analysis (MSA) on testing equipment’s
- Equipment Maintenance & Calibration traceability
- In-process Troubleshooting process by QA team
- Production Process Changes control
- Full traceability managed by ERP System
- Document Management
- Failure Analysis
Continuous Improvement:
- Internal & subcontractor audit program
- Yield improvement program
- Lean Six Sigma program
Certifications
Teledyne e2v level
- ISO 14001: 2004 / OHSAS 18001: 2007 The Grenoble site is “Environment registered facilities (ICPE)” and controlled by the French administrations.
ISO 14001
Site level
- ISO9001 V. 2015 Design, manufacturing and testing of microelectronic components, electronic systems and electronic systems.
- AEO (Authorised Economic Operator) International custom certification.
ISO 9001
Semiconductors Division
- AS9100C – EN9100:2009 Design, manufacturing and testing of microelectronic components for aerospace applications.
- MILPRF 38535 Class Q and V from the American ministry of defence managed by the DSCC (Defense Supply Center Columbus), class V for space market products.
MIL-PRF-38535
Compliance
High level of compliance & reliability cannot be achieved without relevant testing. Through years Teledyne e2v Grenoble has acquired deep knowledge of the failure mechanisms and the associated tests. Each of our packaging technology or assembly process is fully qualified prior to implementation.
In addition our Process & Quality engineers can help you define the optimum test plan for your specific application or product.
- Bond strength (bond pull & ball shear)
- Fine and gross leak
- Lead finish adhesion
- Mechanical shock
- Partical impact noise detection (PIND)
- Resistance to solvents
- Solderability
- Thermal shock
- Constant acceleration
- C SAM
- Internal vapor Content / Residual Gas Analysis (RGA)
- Lead integrity
- Moisture resistance
- Moisture Sensitivity Level (MSL) preconditionning
- Resistance to solder heat
- Salt atmosphere
- Temperature cycling
- Vibration
- ….
Industrialization and Manufacturing Services
Teledyne e2v Grenoble provides state-of-the-art Assembly and Test services to customers seeking high-end packaging technologies.
- Package type options: Wire Bond, Flip-chip, BGA, SiP, MCM,…
- Tailor-made approach
- Low and medium volume
- Hi-Rel / High-end / Specific Assembly & Test
- Supported products: Microprocessors, FPGAs, Asics, Data Converters, image Sensors…
- Semiconductor Lifecycle Management: Support of obsolete solutions, such as SnPb devices
- Segregation of data and flow as per customer request