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26 October 2020

Teledyne Imaging New Technology Showcase, 17-19 Nov 2020

6 Industrial Imaging Technology Sessions, 1 Must Attend Virtual Event

17-19 November 2020

While Covid-19 has forced the cancellation of tradeshows and conferences around the world, our product development team hasnâ€t slowed at all. Over the last six months, weâ€ve introduced dozens of new imaging components, driving significant advances in key industrial vision segments; including machine learning and AI; extreme high-resolution and high-speed imaging; 3D sensing; multi-spectral imaging; and high-volume, low-cost CMOS sensors. Please join us for this multi-session, virtual event to learn about the newest and most innovative imaging solutions from Teledyne including these sessions discussing Teledyne e2vâ€s CMOS sensor technology:

New Advances in 3D Sensing – Wednesday 18 November, 10:30 (ET)
Speakers:
Ha Lan Do Thu – Marketing Manager, Teledyne e2v
Sergio Morillas – Business Manager, Teledyne e2v
Inder Kohli – Senior Product Manager, Teledyne DALSA

Evolving CMOS Sensor Technology – Thursday 19 November, 10:30 (ET)
Speakers:
Florian Julien – Business Manager, Teledyne e2v
Marie-Charlotte Leclerc – Product Manager, Teledyne e2v

Find out more and register.