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12 November 2018

Teledyne e2v completes first multi-chip-module assembly on organic flip-chip

Teledyne e2v, an aerospace qualified manufacturer of advanced semiconductors, has announced today that it has completed the assembly of its first Multi-Chip-Module (MCM) on organic substrate.

After the successful completion of the QML-Y certification, being the sole manufacturer to have obtained as of today this certification in Europe, Teledyne e2v is pursuing its roadmap to address high end, high reliability markets with state-of-the-art components. The module, using five dies assembled in flip-chip, is for an internal Teledyne customer.

Evelyne Tur, General Manager of the Integrated Microelectronics Solutions business unit comments: “We are very proud of this achievement, which is a great step forward in our roadmap to supply the space and aeronautics industry with leading edge, high reliability products using organic flip-chip assembly techniques. It shows our commitment to supply the European space industry with long term solutions for high end, demanding devices. These developments will serve both our external and internal customers and will help to strengthen our offering with more competitive solutions”.

Nicolas Chantier, Marketing Director for conversion products, adds: “We are very happy to have the in-house capability to develop our future data conversion modules, based on our state-of-the art analog-to-digital and digital-to-analog converters. We see a high demand in the future for this kind of products, whether this is for Space, Aerospace or Defence”.

For more information, please visit teledyne-e2v.com/IMS. You can also visit us on our booth C4.324 at Electronica, Munich, 13-16 November to find out more about our assembly and test services.

About Teledyne e2v

Teledyne e2v’s innovations lead developments in healthcare, life sciences, space, transportation, defence and security, and industrial markets.

Teledyne e2v’s unique approach involves listening to the market and application challenges of customers and partnering with them to provide innovative standard, semi-custom or fully-custom imaging solutions, bringing increased value to their systems. In combination with its sister companies, Teledyne DALSA and Teledyne Imaging Sensors, three imaging powerhouses together represent a new paradigm in the delivery of innovative imaging solutions built on unrivalled expertise and a deep technological heritage that includes capabilities across the spectrum, from infrared to x-ray imaging. For more information www.teledyne-e2v.com.