28 June 2019 | Semiconductors
Teledyne e2v and Logic-X are collaborating on the design and development of an FPGA mezzanine card (FMC) that incorporates two of the latest Converter chips from Teledyne e2v
Older news archives
Total results (337)
Corporate (4)
Imaging (7)
RF Power (1)
Semiconductors (10)
Space & Science Imaging (11)
12 June 2019 | Imaging
Teledyne e2v’s Emerald 67M, Ultra-high Resolution Image Sensor Now Available
15 May 2019 | Corporate
Teledyne e2v Holds Successful UK Space Industry SME Forum Event
29 April 2019 | Corporate
European Space Agency names PLATO exoplanet hunting mission sensors in memory of Jean-Francois Bruyères
28 March 2019 | Imaging
Teledyne Imaging’s latest industrial vision solutions featured at Automate 2019
18 March 2019 | Imaging
Teledyne e2v and Teledyne DALSA join as Teledyne Imaging at Vision China Shanghai
13 March 2019 | Semiconductors
Teledyne e2v, Wind River and CoreAVI selected to provide processing technology for BAE Systems’ mission computer
4 March 2019 | Semiconductors
Teledyne e2v releases first military qualified Arm® based processor for Hi-Reliability applications
25 February 2019 | Corporate
Working Together to grow the UK Space Market – 14th May 2019
4 February 2019 | Semiconductors
New DAC Aims to Ease System Design
