Teledyne e2v doesn’t just make products, every single person in our company is using their minds, experience and skills to bring difficult and hard to engineer ideas to life in a way that has real world application and benefits society.
Regardless of the market sector an idea may target we work with universities and academics to bring early stage research into commercial application quickly.
The development of quantum technologies for civil, maritime, space and even medical applications is just one recent example of how Teledyne e2v continues to demonstrate its unique approach to the industrialization of academic research.
Our Grenoble, France site is a state of the art facility, with automated production areas including fixed cell and mobile assembly robotics, offering small to medium batch silicon processing and image sensor manufacturing services in class 5 and 6 clean room environments and fully compliant ESD protection and regulated temperature and humidity.
With production capacity up to 80,000 semiconductor based chips per year and very short production cycle times (up to <1 week) we can quickly efficiently productionise your product lines and provide the necessary manufacturing support systems through supply chain management to quality and certification.
The vast range of services available which are described above highlight how our people, equipment and infrastructure comes together to produce a diverse portfolio of business groups, products and turnkey solutions. This capability places Teledyne e2v in a unique and ideal position to be leveraged by other industrial companies to produce engineered products on their behalf. Whether it be semiconductors in packages, silicon based image sensors, large laser based ground to satellite quantum key distribution stations, or integrated power solutions for cancer therapy equipment, Teledyne e2v is ready to support your manufacturing needs.
As Europe’s only and one of the three only aerospace qualified manufacturer in the world, we provide outstanding services to fit best your need. We serve demanding markets such as Space, Aerospace and Defense.
Discover our wide range of assembly capabilities: flip-chip on die size up to 550mm and, more than 11 000 bumps, wire bond with gold or aluminum, System in Package, Multi-Chip Module, and SMD; with organic or ceramic substrate.
